Long working life, low viscosity, clear, unfilled, two component epoxide system which cures to a tough, resilient resin for use at Class H temperatures
Trickle and dip roll of rotors, bonding and potting of electrical / electronic components.
Trickle and dip roll of rotors processing is carried out at temperatures in the region of 50°C – 90°C. Potting and general sealing applications ideally should be performed at room temperature. Best results are achieved when the material is processed under vacuum.