For all official information and updates regarding COVID-19, visit the South African Department of Health’s website at www.SAcoronavirus.co.za

Hot Moulding Mica-Shellac

Hot Moulding Mica-Shellac

01-99 Shellac Mould Plate

Composition

01-99 plate is a Class B hot forming moulding plate. It is made with partially cured shellac binder generally between 10 to 22 %. It softens under heat to facilitate good moulding. There are different grades of 01-99 mould plate available depending upon the type of mica used, binder content, and surface characteristics.

Applications

For hot moulding of intricate parts such as mica commutator cones or V-rings, end bell insulation, slot cells, coil forms and tubes

Processing

The layout consisting of the required number of layers of thin mica moulding plates (cut to definite shape) is set in a pre-determined pattern. It is then heated uniformly to a temperature of 130°C – 160°C till it becomes soft. It takes the required form when moulded under pressure.

It retains its form when cooled under pressure. The duration, temperature and pressure will have to be determined by application. These moulded parts, if required, can be fully cured under heat and pressure for several more hours to develop their full properties.

 

Download Full Brochure

Hot Moulding Mica-Shellac

Description

Typical curing schedule for hot moulded parts:
Temperature 160°C -180°C
Pressure 14 – 38 kg/cm2
Duration 2 to 4 hrs
Exact curing schedules are to be arrived at by the users, depending on the desired final properties of the moulded parts.

 

Product Data
Property Value Value
Thermal Classification °C 130
Thickness mm 0.4 – 1.6
Thickness Tolerance mm Avg. ± 0.05; Individual ± 0.075
Binder Content % 10 – 22
Mouldability When material heated (135°C – 150°C) & moulded over a mandrel of 25 mm dia., no deflaking to be observed
kV/mm kV/mm >16

Shelf Life

Six months at 20°C from the date of manufacturing.

Different Grades
Code No. Type of Mica Binder Content,% Milled/Unmilled
01-99-01 6 1st Ruby 16 – 22 Milled
01-99-03 6 1st Ruby 14 – 18 Milled
01-99-04 6 1st Ruby 08 – 12 Milled
01-99-05 6 1st Ruby 12 – 15 Unmilled
01-99-06 6 1st Green 10 – 12 Unmilled
01-99-07 6 1st Ruby 15 – 18 Unmilled
01-99-09 6 1st Ruby 15 – 20 Touch Milled
01-99-10 6 DL Ruby 04 -07 Milled
01-99-11 6 1st Ruby/ 6 DL 12 – 15 Touch Milled
01-99-12 4 BF/5 BF 13 – 30 Unmilled
01-99-20 1 mil Kapton film in between two layers of 01-99-01 04 – 07 Unmilled

For moulding small parts, high bond content of 18 – 22% is more suitable. For moulding large commutator Cones, medium bond of 12— 15% is preferred. 15— 18 % bond is preferred for moulding parts with medium dimensions.

Available size of sheets

1050 mm x 780 mm ± 10 mm
780 mm X 525 mm ± 10 mm